| 发明名称 |
Resin composition for sealing light emitting device |
| 摘要 |
A curable composition for sealing a light emitting device, comprising a modified polysiloxane containing, in a molecule, not less than one alicyclic hydrocarbon group and not less than two epoxy groups. |
| 申请公布号 |
US2005272896(A1) |
申请公布日期 |
2005.12.08 |
| 申请号 |
US20050140197 |
申请日期 |
2005.05.31 |
| 申请人 |
ASAHI KASEI CHEMICALS CORPORATION. |
发明人 |
KAJI SATORU;USUI TAKETOSHI |
| 分类号 |
C08L63/00;C08G77/22;C08G77/38;C08L83/06;H01L23/29;H01L23/31;H01L33/56;(IPC1-7):C08G77/22 |
主分类号 |
C08L63/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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