| 摘要 |
PROBLEM TO BE SOLVED: To form an insulating layer in which the resin for bonding is not flipped much by a film-like insulating material and minute peeling does not develop much. SOLUTION: A superconducting wire is wound to constitute a winding part 2 around which an insulating layer 3 is formed using a film-like insulating material. The winding part 2 is bonded to a support body 1 through the insulating layer 3. A bonding resin 3c is used to bond the winding part 2 to the insulating layer 3. A fitting layer 3d of bonding resin is formed on the surface of the insulating layer 3, and the fitting layer 3d is bonded to the support body 1 using the bonding resin. COPYRIGHT: (C)2006,JPO&NCIPI |
