| 摘要 |
PROBLEM TO BE SOLVED: To provide a motor driving semiconductor device which can prevent erroneous operation when a negative voltage is applied to a motor output terminal and can reduce a chip size. SOLUTION: In the semiconductor device, lower arm side power elements 6 to 8 and a small signal unit 2 are arranged on a semiconductor chip 1 with upper arm side power elements 3 to 5 disposed therebetween. Bonding pads 12 to 23 for input terminals are arranged in the periphery of the semiconductor chip 1. ESD protection elements 27 to 29 and 36 to 38 corresponding to the bonding pads 12 to 15 adjacent to the lower arm side power elements 6 to 8 and corresponding to the bonding pads 16, 23 adjacent to the upper arm side power elements 3to 5 are arranged within the small signal unit 2. The bonding pads 12 to 15, 16 and 23 and the ESD protection elements 27 to 29 and 36 to 38 are connected by aluminum wiring lines having a sufficiently large width. COPYRIGHT: (C)2006,JPO&NCIPI
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