| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate washing method and a substrate washing apparatus which can prevent chemicals from remaining on the surface of a substrate by not mixing the chemicals and a washing liquid at the time of continuous spin etching using the chemicals of different kinds. SOLUTION: The substrate washing apparatus comprises chemical dropping nozzles 1a and 1b, a substrate supporter 3 for holding a semiconductor wafer 2 (hereinafter referred to as a wafer), a washing liquid nozzle 4, and a peripheral ring 5. From the chemical dropping nozzles 1a and 1b, different kinds of chemicals are dropped on the wafer. The washing liquid nozzle 4 has a function of dropping the washing liquid. The substrate supporter 3 is able to turn by the prescribed number of times at a prescribed angular velocity for a prescribed period of time while holding the wafer. The peripheral ring 5 has such a structure that an upper part is tightly adhered to the substrate supporting portion 3 while a lower part is kept away from the substrate supporter 3, and is able to move up and down. COPYRIGHT: (C)2006,JPO&NCIPI
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