| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit substrate which can perform low cost waterproofing/moisture-proofing treatment effectively to an electronic part carried in a substrate of various shape and to provide a moisture-proof treating method of the electronic circuit substrate. SOLUTION: First, in the front surface 11a of a control substrate 11, a non-flowable urethane resin is injected along the periphery of a front surface region 13a, a barrier is formed and cured. Then, a flowable low-viscosity urethane resin is injected in the front surface region 13a, charged to a height in which the electrode terminal of the electronic part 12a is covered, and cured. The front surface region 14a, 15a, and 16a are similarly injected with a low viscosity urethane resin in similar processes, and the resin is cured. Further, in the rear surface 11b of the control substrate 11, the rear surface region 13b is opened, and an insulating sheet material is adhered to its periphery. And, flowable low-viscosity urethane resin is injected in the rear surface region 13b, charged to a height in which the soldered part of the electrode terminal 12b is covered, and cured. The rear surface regions 14b, 15b, and 16b are similarly injected with the low viscosity urethane resin in the similar process, and the resin is cured. COPYRIGHT: (C)2006,JPO&NCIPI
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