| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To simply form an electroless plating film having excellent flatness and uniformity on a silicon substrate at a low cost by using a catalyzing solution having excellent removing capacity for a silicon oxide film. <P>SOLUTION: A silicon substrate is dipped into an aqueous solution containing hydrofluoric acid, ammonium fluoride and catalyst metal for electroless plating to catalyze the surface of the silicon substrate, and thereafter, a metal film is formed on the surface of the silicon substrate by electroless plating. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
