| 摘要 |
PROBLEM TO BE SOLVED: To provide a head stack assembly and magnetic disk apparatus in which heat radiation is improved at the time of soldering. SOLUTION: The head stack assembly is provided with a flexible printed circuit board, a terminal part arranged on a first main plane of the flexible printed circuit board, a holding member arranged opposing to a second main plane being different from the first main plane of the flexible printed circuit board, and a metal plate incorporated in the holding member and arranged corresponding to the terminal part. As the metal plate is arranged corresponding to the terminal part, heat at the time of soldering the terminal part is radiated from the metal plate, temperature rising by soldering is reduced. COPYRIGHT: (C)2006,JPO&NCIPI
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