BOAT FOR SILICON WAFER HEAT TREATMENT

摘要

PROBLEM TO BE SOLVED: To obtain a boat for silicon wafer heat treatment which will not require troublesome operation and which will not store metal contamination. SOLUTION: Groove type wafer supporting stepped parts 2a are formed on respective supporting columns 2 in order to support the peripheral part of a silicon wafer. An annular upper plate 1 with the same outer diameter as that of a lower plate 3 is fixed to the other end side of respective supporting column 2. The attaching position of the upper plate 1 is lower than the upper end of respective supporting columns 2 by a length corresponding to about 5 pieces of the groove type wafer supporting stepped part 2a, for example. A dummy wafer is mounted on the groove type wafer supporting stepped part 2a positioned above the upper plate 1. COPYRIGHT: (C)2006,JPO&NCIPI