| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce the size and thickness of a multichip module and to improve the heat radiating property and assembling quality of the module. <P>SOLUTION: In a multilayered substrate 2, cavities 6 having such shapes that are almost equal to the lengths, widths, and heights of each mounted component, such as the semiconductor chip 1 and chip component 3, are individually formed and component mounting pads used for mounting the semiconductor chip 1 and chip component 3 are formed in the same planes as those of the bottom surfaces of the cavities 6. In addition, a circuit pattern is formed between the layers of the multilayered substrate 2. The semiconductor chip 1 and chip component 3 are placed in the cavities 6 provided in the substrate 2 and electrically connected to connection pads provided on the bottom surfaces of the cavities 6 through bumps 5 and solder. The semiconductor chip 1 and bumps 5 are protected by burying the chip 1 and bumps 5 with an underfill 7 and a metallic cover 8 is joined to the top surface of the substrate 2 except the cavities 6 with solder 9. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
