| 摘要 |
PROBLEM TO BE SOLVED: To allow electric inspection with a narrow external electrode pitch, while coping with high integration and size reduction in a semiconductor integrated circuit, in a contact probe for an IC socket. SOLUTION: In this contact probe for connecting electrically a semiconductor IC to an inspection circuit board, plungers 1a, 1c are divided by an insulation material 1b, a dividing position is set in a contact point between the plungers 1a, 1c and a solder ball B (or solder bump) of an external electrode, and the plungers 1a, 1c press-abuts thereby to the external electrode of the semiconductor IC and the inspection circuit board to conduct electric connection by two lines of conductors. COPYRIGHT: (C)2006,JPO&NCIPI
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