| 摘要 |
PROBLEM TO BE SOLVED: To provide a compound electronic component and the manufacturing method of the component, easily permitting the realization of required characteristics and strong in bonding strength of sintered forms with each other. SOLUTION: In the compound electronic component constituted of a plurality of sintered forms through an adhesive agent applied on the bonding surfaces of the forms, holes are formed on the bonding surfaces. COPYRIGHT: (C)2006,JPO&NCIPI
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