| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device the number of components and the number of component adjustment times of which are less, and which is obtained at a low cost, and to provide a manufacturing method thereof. SOLUTION: The semiconductor laser device 100 comprises a semiconductor laser 108, light receiving element boards 102, and mirrors 104. A recess 109 is formed on the principal face 103 of the light receiving element board 102 by etching. The mirrors 104 are located to the bottom side of the recess 109. The semiconductor laser is deposited on the principal face 103. The uppermost part of a reflecting face 105 of the mirror 104 is located above the principal face 103. In the manufacturing method, a plurality of the mirrors 104 are mounted on each of the light receiving element boards 102 in a lump. COPYRIGHT: (C)2006,JPO&NCIPI
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