| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board and a part package which obtains solderability of high reliability without being affected by the warpage of the part or a substrate. SOLUTION: A spacer 33 provided on the substrate 21 to increase the coating quantity of soldering paste 26 is formed by using a material which performs a degradation sublimation and dissipates during reflow heating of the solder paste 26. Thus, the warpage of the part 28 or the substrate 21 during reflow processing is absorbed in a gap formed by the vanishing of the spacer 33. The generation of a non-solder improper part is prevented, and a reliable solder junction 26A is obtained. COPYRIGHT: (C)2006,JPO&NCIPI
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