| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant multi-layer sheet which is excellent in dimensional stability, low thermal expansion properties, and solder heat resistance and can be used suitably in the applications of various industrial materials including a circuit base material, a process mold releasing material, an electric insulation material, a printing material, and a magnetic recording medium. SOLUTION: In the heat-resistant multi-layer sheet which is a biaxially oriented laminated thermoplastic resin film comprising at least three layers, at least one layer other than the outermost layer constituting the thermoplastic resin film is a resin layer C comprising a thermoplastic resin A and a liquid crystalline resin B, and a heat-resistant resin layer containing a polyamide acid with its imidation ratio of at least 50% as a main raw material is laminated on at least one surface of the resin film. COPYRIGHT: (C)2006,JPO&NCIPI
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