| 摘要 |
A three-dimensional mounted assembly includes a molded body, a plurality of electronic parts sealed with the molded body, a plurality of interconnections electrically connected to the electronic parts and sealed with the molded body wherein part of at least one of the interconnections is exposed on a first side of the molded body and at least another one of the interconnections is exposed on a second side of the molded body differing from the first side.
|
