Wafer support with a dustproof covering film and method for producing the same

摘要

A wafer support with a dustproof covering film comprises a base, a silicone rubber layer substantially uniform in thickness and integrated with the base and a dustproof covering film. The dustproof covering film is so attached to the silicone rubber layer that the peel strength between the dustproof covering film and the silicone rubber layer is from 5 to 500 g/25 mm, thereby enabling the covering film to be peeled apart as the need arises.