Circuit board and method of manufacturing same

摘要

A circuit board having stable connection resistance can be obtained. The multi-layer circuit board includes the steps of making through-holes (4) in a incompressible substrate (1) having films (3) on either side thereof via a bonding layer (2); filling conductive paste (5) into the through-holes (4); removing the films (3) from the substrate (1); laminating metallic foils (6a,6b) to either side of the substrate (1) and heating same under pressures to harden the bonding layer (2), bonding the metallic foils (6a,6b) to the substrate (1) and electrically connecting the sides of the substrate to each other; and forming a circuit pattern (7a,7b) by machining the metallic foils (6a,6b).