PRINTED WIRING BOARD, METHOD FOR MANUFACTURING SAME, LEAD FRAME PACKAGE AND OPTICAL MODULE

摘要

A printed wiring board (10) includes a plurality of conductor plates (10a) spaced apart from one another including at least one conductor plate that is used as a lead for electrical connection with an external circuit; an insulating layer (10b) formed on or astride the conductor plates or on and astride the conductor plates; and a plurality of wiring patterns (10d) formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns via a via-hole (11a), a method of manufacturing the printed wiring board, and a lead frame package and an optical module that use the printed wiring board.