发明名称 |
ELECTROLYTIC COPPER FOIL |
摘要 |
<p>An object of the present invention is to provide a copper foil having excellent adhesion to an etching resist layer, without performing physical polishing such as buffing in pre-treatment of an etching process to form a circuit from the copper foil. To attain the object, in electroforming, a titanium material having a grain size number of 6.0 or more is employed as a copper deposition surface of the rotating drum cathode, and glue and/or gelatin is added in an amount of 0.2-20 mg/l to a copper sulfate solution, thereby producing a drum foil. An electrodeposited copper foil obtained from the drum foil, wherein 20% or more of the crystals present in a shiny side surface of the electrodeposited copper foil have a twin-crystal structure, is used for producing copper-clad laminates. <IMAGE></p> |
申请公布号 |
EP1167580(A4) |
申请公布日期 |
2005.12.07 |
申请号 |
EP20000977944 |
申请日期 |
2000.11.27 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
NAKANO, OSAMU;KATAOKA, TAKASHI;TAENAKA, SAKIKO;UCHIDA, NAOHITO;HANZAWA, NORIKO |
分类号 |
C25D1/04;C25D3/38;H05K1/09;(IPC1-7):C25D1/04 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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