HIGHLY ELASTIC EPOXY RESIN COMPOSITION

摘要

An epoxy resin composition comprises (A) 1% to 10% by weight of a polyepoxy compound, (B) 1% to 10% by weight of a curing agent selected from a cyanate compound and a benzoxazine compound, (C) 0.1% to 5% by weight of a polyhydric phenol compound, and (D) 80% to 97.9% by weight of a spherical filler having an elastic modulus of 300 GPa or higher and has a void of 3% or less. The epoxy resin composition has a high elastic modulus.