发明名称 Method for manufacturing a light emitting diode having a transparent substrate
摘要 A light emitting diode having a transparent substrate and a method for manufacturing the same. The light emitting diode is formed by creating two semiconductor multilayers and bonding them. The first semiconductor multilayer is formed on a non-transparent substrate. The second semiconductor multilayer is created by forming an amorphous interface layer on a transparent substrate. The two semiconductor multilayers are bonded and the non-transparent substrate is removed, leaving a semiconductor multilayer with a transparent substrate.
申请公布号 US6972208(B2) 申请公布日期 2005.12.06
申请号 US20040709663 申请日期 2004.05.21
申请人 EPISTAR CORPORATION 发明人 HSIEH MIN-HSUN;CHUANG KEUN-RU;WEY SHANE-SHYAN;LU CHIH-CHIANG;JOU MING-JIUNN;SUNG SHU-WEN;LIU CHIA-CHENG;HUANG CHAO-NIEN
分类号 H01L21/00;H01L21/20;H01L21/8238;H01L33/00;H01L33/30;H01L33/32;(IPC1-7):H01L21/00 主分类号 H01L21/00
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