发明名称 |
Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same |
摘要 |
A wire-bonding substrate is described. The wire-bonding substrate includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish completes a structure that includes at least one of a bond finger for wire bonding of a first side of the substrate, and a land pad for a ball attach on a second side of the substrate. A process of forming the surface finish is also disclosed. An electronic package is also disclosed that uses the surface finish on the wire-bonding substrate. A method of assembling an electronic package is also disclosed that includes the surface finish on the wire-bonding substrate. A computing system is also described that includes the surface finish on the wire-bonding substrate.
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申请公布号 |
US6972152(B2) |
申请公布日期 |
2005.12.06 |
申请号 |
US20030608059 |
申请日期 |
2003.06.27 |
申请人 |
INTEL CORPORATION |
发明人 |
TAGGERT BRIAN;HACKITT DALE;MISRA DILIP K. |
分类号 |
C23C28/02;C23C30/00;H01L23/498;H05K3/24;H05K3/34;(IPC1-7):B32B9/00;H01L23/48 |
主分类号 |
C23C28/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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