发明名称 Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment
摘要 A composite flexible wiring board comprises a first flexible wiring board and a second flexible wiring board on which a surface-mounted part is provided. The second flexible wiring board is disposed on the first flexible wiring board in its predetermined area. The first flexible wiring board and the second flexible wiring board are electrically connected to each other through an interlayer contact portion provided in a predetermined position. The first flexible wiring board has an input terminal region and an output terminal region with a power IC chip mounted on the first flexible wiring board.
申请公布号 US6972966(B1) 申请公布日期 2005.12.06
申请号 US20000661187 申请日期 2000.09.13
申请人 SEIKO EPSON CORPORATION 发明人 OISHI EIJI;ENDO KOGO
分类号 G02F1/1345;G02F1/13;G02F1/1333;G09F9/00;H05K1/14;H05K1/18;H05K3/28;H05K3/32;H05K3/36;H05K3/46;(IPC1-7):H05K1/11 主分类号 G02F1/1345
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