Mold for semiconductor package,申请号KR20000032219-传众专利搜索

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发明名称	Mold for semiconductor package
摘要
申请公布号	KR100533756(B1)	申请公布日期	2005.12.06
申请号	KR20000032219	申请日期	2000.06.12
申请人		发明人
分类号	H01L21/56;(IPC1-7):H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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