| 摘要 |
A high quality factor on-package, off-die inductor assembly is disclosed. The assembly includes a flip-chip, ball-grid array package substrate, an on-package, off-die trace line is coupled to one or more bumps attached to an upper surface of the package substrate. The trace line has a self-inductance and a predetermined length. The quality factor associated with the inductor is a ratio of the trace line's inductance to the trace lines resistance. The package substrate is a low loss laminate.
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