发明名称 Thermal module with temporary heat storage
摘要 A thermal module with temporary heat storage. The thermal module includes a heat storage, a heat absorber, a heat dissipater, and a heat pipe for rapidly transferring heat from the heat absorber to the heat dissipater. The heat storage includes a phase change material and is in contact with the heat pipe. When heat quantities generated by the system are greater than a predefined reasonable thermal target, heat in excess of the thermal target is temporarily absorbed into the heat storage through the melting of the PCM. When the heat quantities generated by the system are again less than the thermal target, the PCM re-freezes, releasing the stored heat to be dissipated normally.
申请公布号 US6971443(B2) 申请公布日期 2005.12.06
申请号 US20020065430 申请日期 2002.10.17
申请人 COMPAL ELECTRONICS, INC. 发明人 KUNG SHAO-TSU;LIU CHEN-HUA
分类号 F28D15/02;H01L23/427;(IPC1-7):F28D17/00 主分类号 F28D15/02
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