| 摘要 |
A method for the continuous selective electroplating of a metallic substrate material ( 10 ) and more particularly of a substrate material band having prestamped contact elements, comprises the following steps: a) the substrate material ( 10 ) is coated in an electrophoretic coating means ( 14 ) with an electrophoretic coating composition selective with at least one composition strip, b) the at least one composition strip is removed at those parts by means of a laser ( 40 ), which are to be electroplated, c) in an electroplating process a metal layer is applied to the areas ( 42 ) deprived of composition in at least one composition strip using selective electroplating and d) the at least one composition strip is then removed.
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