| 摘要 |
<P>PROBLEM TO BE SOLVED: To effectively exclude a jumped area (jump shot, etc.) which may exert influence to positioning errors, or to effectively reduce the influence and to highly accurately position the jumped area (shot area, etc.) formed on an object (substrate, etc.) to a prescribed processing position (exposure position, etc.), in an exposure device for successively transferring mask or reticle patterns to respective shot areas on the substrate. <P>SOLUTION: EGA operation is performed by using the design values of a plurality of sample shots SA<SB>1</SB>to SA<SB>8</SB>set on a wafer 8 and the measured values and their positional information to calculate an error vector indicating an alignment error. As to the sample shots SA<SB>1</SB>to SA<SB>8</SB>, a pair of center symmetrical measurements which are approximately symmetrical about the center of a wafer 8 is prepared, a correlation of error vectors of sample shots making the center symmetrical measurement pair is found out, the center symmetrical measurement pair is rejected or composed in accordance with the correlation, and then the array of short areas on the substrate is finally determined. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
