| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide MEMS package and its manufacturing method airtightly sealing MEMS element in order to protect from outside environment by forming a sealing member on a side surface of a lid glass installed on a spacer surrounding the MEMS element of a base substrate and covering the MEMS element. <P>SOLUTION: A first metal layer is patterned on the base substrate to a shape surrounding the MEMS element formed on the base substrate, the spacer is installed in the state in which it is contacted with the first metal layer in order to form a free space for vertical driving of the MEMS element and the lid glass formed with a second metal layer at a part contacted with the spacer is installed on the spacer. Thereafter, in order to airtightly seal the MEMS element, the seal member is formed on the first metal layer, the spacer and a side surface of the second metal layer of the lid glass. Thereby, the MEMS element formed on the base substrate is airtightly sealed from the outside environment. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
