发明名称 SUPPORT PLATE
摘要 PROBLEM TO BE SOLVED: To provide a support plate formed of synthetic resin whose material cost can be reduced, which can be lightened compared to a plate formed of glass and can be enlarged, and which can prevent damage due to falling at the time of conveyance or handling due to weight increase. SOLUTION: The support plate 5 (basic thickness: 1mm, variation: within 15μm and bending elastic modulus: 25MPa) formed of polycarbonate is slightly bent. A wafer 3 is stuck to an adhesion layer 4 while an air layer between the wafer 3 and the adhesion layer 4 is removed. Bubbles are prevented from remaining between the wafer 3 and the adhesion layer 4. The wafer 3 is stuck to the support plate 5 by making a diced face side up. The wafer 3 supported by the support plate 5 is diced into a prescribed size by a dicing blade. Since the support plate is formed of synthetic resin, material cost can be reduced, and the support plate can be lightened compared to the plate formed of glass. Thus, the support plate can be enlarged. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005333101(A) 申请公布日期 2005.12.02
申请号 JP20040332399 申请日期 2004.11.16
申请人 SEKISUI CHEM CO LTD 发明人 HIRANO HIROYUKI
分类号 H01L21/683;H01L21/301;H01L21/68;(IPC1-7):H01L21/301 主分类号 H01L21/683
代理机构 代理人
主权项
地址