发明名称 HEAT-DISSIPATING SILICONE GREASE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a heat-dissipating silicone grease composition which exerts a good heat-dissipating effect. SOLUTION: The heat-dissipating silicone grease composition comprises (A) 60-98 mass% at least one thermally conductive filler chosen from the group consisting of a metal powder, a metal oxide powder and a ceramic powder each having a thermal conductivity of≥10 W/m°C and an average particle size of 0.1-15.0μm and (B) 2-40 mass% organopolysiloxane of the formula (1): R<SP>1</SP><SB>a</SB>SiO<SB>(4-a)/2</SB>(wherein each R<SP>1</SP>is independently a 1-18C saturated or unsaturated monovalent hydrocarbon group; and a is a positive number satisfying the relation: 1.8≤a≤2.2) having dynamic viscosity of 50-500,000 mm<SP>2</SP>/s at 25°C. Here, coarse grains retained on 500 mesh (25μm aperture) account for≤50 ppm in the heat-dissipating silicone grease composition, and coarse grains retained on 325 mesh (45μm aperture) are substantially absent. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005330426(A) 申请公布日期 2005.12.02
申请号 JP20040151706 申请日期 2004.05.21
申请人 SHIN ETSU CHEM CO LTD 发明人 YAMADA KUNIHIRO;ENDO AKIHIRO
分类号 C10M169/02;C08K3/00;C08L83/04;C10M107/50;C10M125/02;C10M125/04;C10M125/10;C10M125/20;C10M125/26;C10N10/02;C10N10/04;C10N10/06;C10N10/16;C10N20/00;C10N20/02;C10N20/06;C10N30/08;C10N50/10;(IPC1-7):C10M169/02 主分类号 C10M169/02
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