| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC module and an IC card for reducing any damage, and for suppressing the thickness of the IC card by reinforcing an IC chip without affecting the electric connection of the conventional IC module. SOLUTION: This IC module is configured by installing a connection terminal on the surface side of a printed circuit board, and providing an IC chip on the back surface of the printed circuit board. A reinforcement board configured almost in the same shape as that of the IC chip surface side, to be more specific, excluding a bump section or wire section is attached to the IC chip surface side. COPYRIGHT: (C)2006,JPO&NCIPI
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