| 摘要 |
PROBLEM TO BE SOLVED: To resolve a handling problem that, when a conventional pre-dicing technique is applied to an elastic surface acoustic device, an element material is fragile as compared to a semiconductor and therefore it easily breaks when thinned. SOLUTION: In the manufacturing method of the elastic surface acoustic device, after a plurality of elastic surface acoustic elements 12 are subjected to flip-chip mounting on a wiring substrate 11, only a rear of the elastic surface acoustic element 12 is ground while holding the wiring substrate 11, and after a mounting surface is cleaned, the wiring substrate 11 is cut and divided into individual devices. Consequently, a flat elastic surface acoustic device can be manufactures at a good yield, and characteristic can be also improved. COPYRIGHT: (C)2006,JPO&NCIPI
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