| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure for fixing an electronic component rigidly to a wiring board with high productivity. <P>SOLUTION: The structure for fixing an electronic component to a wiring board comprises a wiring board 2 provided with a wiring pattern 3 having lands 3a, and an electronic component 1 having a plurality of electrodes 1b being soldered to the lands 3a. Since the lands 3a are formed of a first solderable metal material and the wiring pattern 3 contiguous to the land 3a is provided with a second non-solderable metal material, outflow of solder from the land 3a can be prevented by the second metal material. Since a conventional solder resist film can be eliminated, productivity is enhanced and the electronic component 1 can be fixed rigidly to the surface of the wiring board 2 through adhesive 6. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
