| 摘要 |
PROBLEM TO BE SOLVED: To prevent occurrence of a short-circuit between bumps even if pitches between the bumps are made narrow in the manufacturing method of a semiconductor device where a projection electrode installed in the semiconductor chip is bonded to a pad arranged in a member to be mounted. SOLUTION: The manufacturing method of the semiconductor device has a process for bonding stud bumps 8B disposed in a daughter chip 2B to the pads 15 arranged in a mother chip 3B, and a process for electrically connecting a probe 25 to the pads 15 by stabbing the probe to the pad and conducting a test of the mother chip 3B is formed. When the stud bumps 8B are bonded to the pads 15, recesses 26 whose shapes are sequentially extended toward opening ends formed in the pads 15 and tapered small projections 27 formed at tip parts of the stud bumps 8B are engaged and are bonded by the probe 25. COPYRIGHT: (C)2006,JPO&NCIPI |
