| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device with a high reliability preventing a migration generation caused by a deposit of a metal ion from wirings. <P>SOLUTION: There are provided a flexible wiring board 11 in which plural wirings 9 are arranged on a base film 1, a semiconductor chip 5 loaded on the flexible wiring board 11, and a sealing resin 6 so that at least one portion thereof may contact with the wirings 9. Metal ionic bonding agent is blended with the sealing resin 6. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
