| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate of a resin film and an electroconductive layer reduced in the lowering of the adhesion strength between the resin film and the electroconductive layer namely having high heat-resistant adhesivity even after exposed to a high temperature atmosphere for a long time, which is mainly used as an electric/electronic circuit material. SOLUTION: An adhesion strength enhancing layer containing chromium, a copper diffusion-barrier layer containing nickel or molybdenum and the electroconductive layer comprising copper or a copper alloy are formed on one side or both sides of the resin film containing a polyimide resin. In the peel surface of the resin film and the electroconductive layer, the ratios of the respective atomic numbers of copper, iron, aluminum and silver occupying the total atomic number are set to 0.1% or below. COPYRIGHT: (C)2006,JPO&NCIPI
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