发明名称 COATING FILM FORMATION APPARATUS AND COATING FILM FORMATION METHOD
摘要 PROBLEM TO BE SOLVED: To provide a coating film formation apparatus capable of easily performing setting of a condition for forming a coating film having a desired property and enhancing productivity, and a coating film formation method. SOLUTION: A resist coating device 11 for forming a resist liquid film by scanning a resist nozzle 52 for delivering the resist liquid in an approximately band-like shape on a substrate G has a recipe preparation device 30 for preparing a treatment recipe in order to form the resist liquid film having a desired property on the substrate G. When a coating treatment parameter is inputted to the recipe preparation device 30, the other coating treatment parameter is calculated from coordination data constituting a data part 37 and delivery of the coating liquid from the resist nozzle 52 and scanning and lifting action of the resist nozzle 52 are controlled from this. When a difference exists between film thickness of the formed resist film and target film thickness, the recipe preparation device 30 corrects the coating treatment parameter. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005329306(A) 申请公布日期 2005.12.02
申请号 JP20040148851 申请日期 2004.05.19
申请人 TOKYO ELECTRON LTD 发明人 IKEDA FUMIHIKO;FUJITA NAOKI;TANAKA YUKINOBU
分类号 B05D1/26;B05C5/02;(IPC1-7):B05C5/02 主分类号 B05D1/26
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