| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit device which can reduce a side etching while forming a thick conductive pattern. <P>SOLUTION: In the method for manufacturing the circuit device, a first isolation trench 41 is formed on the surface of a conductive foil 40, and the conductive pattern to be formed is formed in a projected shape. Further, a second isolation trench 51 is formed on the back of the conductive foil 40 corresponding to a region where the first isolation trench 41 is formed. After the adhesion of a circuit element 12 and its electrical connection are completed, a resin sealing is performed. Thereafter, the back of the conductive foil 40 is etched, thereby isolating each conductive pattern 11. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
