| 摘要 |
PROBLEM TO BE SOLVED: To provide silver compound-covered copper powder for conductive paste capable of forming a conductive wiring part for an electronic circuit at a firing temperature lower than the melting point of copper, and to provide its production method. SOLUTION: Regarding the silver compound-covered copper powder including silver compound-covered copper grains in which the surface of each copper grain is covered (fixed) with a silver compound by a wet process or a dry process, or the silver compound-covered silver coat copper powder including silver compound-covered silver grains in which the surface of each silver grain is covered (fixed) with a silver compound by a wet process or a dry process, by silver thermally decomposed from the silver compound covered (fixed) to the silver compound-covered copper powder or silver compound-covered silver coat copper powder, the respective grains of the silver compound-covered copper powder, silver compound-fixed copper powder, silver compound-covered silver coat copper powder or silver compound-fixed silver coat copper powder are welded to each other, and thereafter, the copper grains are sintered, thus a wiring part on an electronic circuit board, a wiring part in a via hole or the like can be formed. COPYRIGHT: (C)2006,JPO&NCIPI
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