FORMING METHOD OF MULTILAYER WIRING AND MANUFACTURING METHOD OF MULTILAYER WIRING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To form a multilayer wiring with a simple method without giving damage to the wiring or a device.

SOLUTION: The forming method of the multilayer wiring with the structure of a lower layer wiring connected to an upper layer wiring is provided with a first process for forming a stud bump, a second process for forming an insulating layer on the stud bump a third process for forming a via-hole, arriving at the stud bump through laser work, and a fourth process for forming a via wiring filled into the via-hole and the upper layer wiring connected to the via wiring. In this case, the stud bump is employed as the stopper layer of laser when the via-hole is formed.

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