| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for a flexible printed circuit board which is excellent in heat resistance, fire retardancy, and electric characteristics and good in dimensional stability by forming an insulating layer directly, without forming an adhesive layer, on a conductor layer and integrating the insulating layer with an insulating layer through a specified adhesive layer. SOLUTION: In the substrate for the flexible printed circuit board, films of a polyimide resin forming the insulating layer are laminated on both surfaces of the adhesive layer of a thermoplastic polyimide resin, respectively. The conductor layer is formed on the outer surface of each film. The total thickness of the conductor layers formed on both surfaces of the adhesive layer is 5-100μm, and the thickness of the adhesive layer is 6μm or below. COPYRIGHT: (C)2006,JPO&NCIPI |
