| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate plating method by which the sealing structure of a substrate holder is simplified in order to miniaturize plating equipment and to improve the performance thereof and by which deterioration in a plating liquid caused by the drag-out thereof is reduced resulting in an increase in the reliability of the method, and to provide the plating equipment. SOLUTION: The substrate plating method is provided for applying electrolytic or electroless plating treatment to a face W1 to be plated of a substrate W, wherein the substrate W is held by a planar substrate holder 15, the substrate holder 15 is arranged vertically and attached to the outside face of the side wall of a plating tank 11 storing a plating liquid Q, with the interposition of a sealing material in the vicinity of the outer circumference of the substrate W, or a porous material 20, or across a fine gap between the outside face of the side wall and the substrate holder 15, and the face W1 to be plated of the substrate W held by the substrate holder 15 is brought into contact with the plating liquid through an opening 19 provided on the side wall of the plating tank 11 oppositely to the face to be plated, and is subjected to plating treatment. COPYRIGHT: (C)2006,JPO&NCIPI
|
