发明名称 THERMOPLASTIC RESIN COMPOSITION AND MOLDED FORM USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition slight in appearance change even if exposed to high temperature for a long time and good in heat resistance and dimensional stability, and to provide a molded form obtained using the composition. SOLUTION: The thermoplastic resin composition comprises a total of 100 pts. mass of (A) a thermoplastic polyimide resin and (B) a polyaryl ketone resin and 50-5 pts. mass of (C) a filler surface-treated with an organosilicon compound of general formula(1):R<SB>n</SB>SiX<SB>4-n</SB>( wherein, R is a 2-22C unsaturated hydrocarbon group; X is at least one hydrolyzable group selected from a 1-6C alkoxy, halogen atom, acetoxy and hydroxy; n is 1 or 2; when n is 2, one of two R groups may be a hydrocarbon group other than a 1-20C unsaturated hydrocarbon group ). This resin composition is≤10 in the absolute value of the difference of yellowness specified by JIS K 7105-1981 before and after treated at 200°C for 350 h. The molded form is made from this resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005330378(A) 申请公布日期 2005.12.02
申请号 JP20040149966 申请日期 2004.05.20
申请人 MITSUBISHI PLASTICS IND LTD 发明人 SHIBUYA SANEHIRO
分类号 C08L79/08;C08K9/06;C08L71/08;(IPC1-7):C08L79/08 主分类号 C08L79/08
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