| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an Ag alloy sputtering target material for thin film deposition for uniformly depositing an Ag alloy film jointly having low electric resistance, high reflectivity, heat resistance, corrosion resistance and adhesion to a substrate required for an electronic device, on an FPD (Flat Panel Display) with a large area, and to provide an Ag alloy film deposited from the Ag alloy sputtering target material. <P>SOLUTION: The sputtering target material has a composition containing, as additional elements, Zr and/or Hf by 0.1 to 0.7 atomic% in total, Cu and/or Ge by 0.1 to 1.0 atomic% in total, and the balance Ag with inevitable impurities. The Ag alloy sputtering target material has a recrystallized structure in which a second phase including the additional elements is dispersed into a matrix consisting mainly of Ag, and has a Vickers hardness of ≤80 HV. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
