| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress interface break between a solder ball and a conductive film. <P>SOLUTION: When a distance between the end of the solder ball 108 and the upper peripheral edge of a via 104 on a face which is brought into contact with an insulating resin layer 105 is set to be (a), and a distance between the end of a UBM film 107 and the upper peripheral edge of the via 104 to be (b), they satisfy the inequality 0<a/b≤2. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
