| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power amplitude module improved in heat radiating property and durability, and is easily manufactured. <P>SOLUTION: The power amplifier module 1 comprises: a heat spreader 11; a wiring substrate 14 which is mounted on the heat spreader 11 and is provided with a circuit pattern 12 and through-holes 13a, 13b located at the predetermined positions; semiconductor chips 15a, 15b mounted in the bare chip condition on the surfaces 11a, 11b of the heat spreader 11 exposed to the through-holes 13a, 13b and connected with the circuit pattern 12; and a cap 18 fixed on the heat spreader 11 covering the wiring substrate 14. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
