| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer mounter with which the surface and the rear face of a wafer mounted on a frame are reversed and the wafer can automatically be re-mounted on the frame. SOLUTION: A frame separation means 57 separating the wafer W which is mounted on an annular first frame F1 through a first pressure sensitive adhesive sheet S from the first frame F1 by sticking the first pressure sensitive sheet S to one face side, and a frame mounting means 50 mounting the wafer on an annular second frame F2 through a second pressure sensitive adhesive sheet ES by sticking the second pressure sensitive sheet ES to the other face of the wafer W, are arranged on the wafer mounter 10. The surface and the rear face of the wafer W mounted on the frame are reversed and the wafer can automatically be remounted on the different frame. COPYRIGHT: (C)2006,JPO&NCIPI |
