| 摘要 |
PROBLEM TO BE SOLVED: To provide a compound sheet for securing sufficient bonding strength, and for simultaneously satisfying the thinning of an insulating layer and the thickening of a wiring layer even at the time of forming a fine conductive layer which is, 0.5mm angle or less, and also to provide lamination components for easily forming an arbitrary three-dimensional circuit pattern which is high in connection reliability without any delamination, and a method for manufacturing the components. SOLUTION: A compound sheet A is configured by forming a conductive layer 3a at a portion of a photo-setting ceramic layer 1a constituted of composite materials containing at least ceramic powder and photo-setting resin through the photo-setting ceramic layer 1a. The conductive layer 3a and the photo-setting ceramic layer 1a are formed with almost the same thickness, and an angleθmade by a wider main surface 3a-B of the conductive layer 1a and a side surface 3a-S, is 30 to 70°. COPYRIGHT: (C)2006,JPO&NCIPI |
