发明名称 DIE ASSEMBLY FOR MOLDING DISC SUBSTRATE AND METHOD FOR MOLDING DISC SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a die assembly for molding a disc substrate which can flatten the main surface of a disc substrate, and thereby, make the thickness of a cover layer uniform in the manufacture of an optical disc and prevent air bubbles from being generated by an intermediate layer in the manufacture of a multilayer optical disc, and a method for molding the disc substrate. SOLUTION: A molding die 10 is constituted of a cavity side half and a movable half, and the cavity side half has a cavity side mirror constituted of an inner peripheral mirror 11 and an outer peripheral mirror 18. On the other hand, the movable side die has a movable side mirror 14 and an outer peripheral ring 17 and the cavity side mirror surface mirror to which a stamper 11a is attached, is formed of an inner peripheral side mirror surface 11b and an outer peripheral side mirror surface 18a. In addition, the outer peripheral part of the cavity side mirror surface is bent by the outer peripheral side mirror 18 in a direction where the thickness of the outer peripheral part of the disc substrate to be molded becomes gradually thinner. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005329670(A) 申请公布日期 2005.12.02
申请号 JP20040151793 申请日期 2004.05.21
申请人 SONY DISC & DIGITAL SOLUTIONS INC 发明人 YOSHIMURA HIDEAKI;YAGI MASATAKE
分类号 B29C45/26;B29L17/00;G11B7/26;(IPC1-7):B29C45/26 主分类号 B29C45/26
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